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	Metal microstructure microfabrication technique
	Wu Ying ; Zhou Zhao-ying ; Jing Yong-qing ; Xiang Yi ; Takahito Ono
	2010-05-10 ; 2010-05-10
关键词	Practical/ electroplating LIGA micromechanical devices photoresists sputter etching/ metal microstructure microfabrication 3D microstructure MEMS microfabrication technology 3D microfabrication SU-8 photoresist integrated circuit process LIGA-type microfabrication SU-8 microfabrication strip off process metal materials silicon deep etching electroplating silicon mold high aspect ratio microstructures reactive ion etching/ B2575F Fabrication of micromechanical devices B0520J Deposition from liquid phases
中文摘要	The fabrication technique of three-dimensional microstructure is important in the MEMS microfabrication technology. The main methods of silicon three-dimensional microfabrication combine the SU-8 photoresist and IC process and LIGA-type microfabrication. However, SU-8 microfabrication has limitation on the strip off process and the cost of LIGA-type is high. So, a new three-dimensional microfabrication technique for metal materials was developed from the silicon deep etching technique and electroplating technique. In the present research, a silicon mold with high aspect ratio microstructures was manufactured and metal micro structures were fabricated using this mold. A successful development of this technique opens an alternative way for three dimensional microfabrication techniques.
语种	中文 ; 中文
出版者	Editorial Board of the Instrument Technique and Sensor J ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/25297]
专题	清华大学
推荐引用方式 GB/T 7714	Wu Ying,Zhou Zhao-ying,Jing Yong-qing,et al. Metal microstructure microfabrication technique[J],2010, 2010.
APA	Wu Ying,Zhou Zhao-ying,Jing Yong-qing,Xiang Yi,&Takahito Ono.(2010).Metal microstructure microfabrication technique..
MLA	Wu Ying,et al."Metal microstructure microfabrication technique".(2010).

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