| Evaluating modulus and hardness enhancement in evaporated Cu/W multilayers | |
| Wen, S. P. ; Zong, R. L. ; Zeng, F. ; Gao, Y. ; Pan, F. | |
| 2010-05-10 ; 2010-05-10 | |
| 关键词 | modulus enhancement hardness Cu/W multilayers nanoindentation supermodulus MECHANICAL-PROPERTIES THIN-FILMS METALLIC MULTILAYERS ELASTIC-MODULUS SUPERLATTICES COMPOSITES COATINGS MICROINDENTATION STRESSES BEHAVIOR Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering |
| 中文摘要 | The microstructure, hardness and elastic modulus of Cu/W multilayers prepared by evaporation deposition were investigated by Xray diffraction, transmission electron microscopy and nanoindenation. The results show that the multilayers with good modulation structure have asymmetrical interfaces. The W on Cu interfaces are relatively sharp, while the Cu on W interfaces are diffuse, with significant intermixing. The intermixing results in compression of the out-of-plane interplanar spacing of the W layer. The compression increases with decreasing periodicity and leads to modulus enhancement. The hardness values also increase with decreasing periodicity, which is interpreted by the Lehoczky model. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 语种 | 英语 ; 英语 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD ; OXFORD ; THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND |
| 内容类型 | 期刊论文 |
| 源URL | [http://hdl.handle.net/123456789/21629]  |
| 专题 | 清华大学 |
| 推荐引用方式 GB/T 7714 | Wen, S. P.,Zong, R. L.,Zeng, F.,et al. Evaluating modulus and hardness enhancement in evaporated Cu/W multilayers[J],2010, 2010. |
| APA | Wen, S. P.,Zong, R. L.,Zeng, F.,Gao, Y.,&Pan, F..(2010).Evaluating modulus and hardness enhancement in evaporated Cu/W multilayers.. |
| MLA | Wen, S. P.,et al."Evaluating modulus and hardness enhancement in evaporated Cu/W multilayers".(2010). |
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