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	Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut (R) technology
	Gu, Bin ; Liu, Hong-Yuan ; Mai, Yiu-Wing ; Feng, Xi-Qiao ; Yu, Shou-Wen
	2010-05-10 ; 2010-05-10
会议名称	ENGINEERING FRACTURE MECHANICS ; 8th International Conference on Fundamentals of Fracture ; Clear Water Bay, PEOPLES R CHINA ; Web of Science
关键词	Smart-Cut technique Fracture mechanics Deflection angle Energy release rate Thermal mismatch CUT TECHNOLOGY Mechanics
中文摘要	Annealing temperature is very critical in the Smart-Cut process especially when material mismatch exists. Experiments have shown that high temperature along with thermal mismatch may fail the Smart-Cut process by inducing severe deformation or cracks on the films. The present paper, following our previous investigations on the Smart-Cut process, studies the effects of temperature and material mismatch on wafer splitting in the Smart-Cut technology by using fracture mechanics analysis. The influence of temperature is explored through its effect on the internal pressure inside the defects and thermal stresses whether the donor wafer and the handle wafer are the same materials or not. Our analysis shows that increasing temperature may promote defect growth by increasing the internal pressure, and that thermal stresses arising from temperature change accompanied by material mismatch may inhibit defect growth and lead to growth deviation. In addition, the results indicate that the elastic mismatch of materials plays a significant role in wafer splitting in the Smart-Cut process even when the thermal stresses vanish. (c) 2008 Elsevier Ltd. All rights reserved.
会议录出版者	PERGAMON-ELSEVIER SCIENCE LTD ; OXFORD ; THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD OX5 1GB, ENGLAND
语种	英语 ; 英语
内容类型	会议论文
源URL	[http://hdl.handle.net/123456789/19115]
专题	清华大学
推荐引用方式 GB/T 7714	Gu, Bin,Liu, Hong-Yuan,Mai, Yiu-Wing,et al. Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut (R) technology[C]. 见:ENGINEERING FRACTURE MECHANICS, 8th International Conference on Fundamentals of Fracture, Clear Water Bay, PEOPLES R CHINA, Web of Science.

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