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	Study on thermal shock resistance of insulated metal substrate
	Guo, LQ ; Liu, Y ; Ma, JS
	2010-05-10 ; 2010-05-10
会议名称	PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 ; 5th Pacific Rim International Conference on Advanced Materials and Processing ; Beijing, PEOPLES R CHINA ; Web of Science
关键词	insulated metal substrate anodizing process thermal shock resistance BGA Materials Science, Multidisciplinary
中文摘要	Anodizing technique was applied to prepare insulated metal substrates (IMS) for BGA packaging. "Ideal" IMS used anodic film of aluminum as the insulating layer instead of epoxy, which led to higher thermal conductivity. But the thermal shock resistance of IMS is poor because of the great difference of thermal expansion coefficient between aluminum and its anodic film. In this study, different anodizing processes of aluminum were analyzed. The parameters, which can affect the thermal shock resistance of IMS, especially the surface temperature of Al substrate, were studied. The anodic film obtained with the optimized parameters of anodizing process had excellent performance, such as the resistivity was over 10(13) Omega(.)cm, the breakdown voltage was higher than 600V, and the most important thing was that it could resist thermal shocks between room temperature and 300 degrees C. Then BGA packaging was successfully performed based on this IMS.
会议录出版者	TRANS TECH PUBLICATIONS LTD ; ZURICH-UETIKON ; BRANDRAIN 6, CH-8707 ZURICH-UETIKON, SWITZERLAND
语种	英语 ; 英语
内容类型	会议论文
源URL	[http://hdl.handle.net/123456789/18112]
专题	清华大学
推荐引用方式 GB/T 7714	Guo, LQ,Liu, Y,Ma, JS. Study on thermal shock resistance of insulated metal substrate[C]. 见:PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 5th Pacific Rim International Conference on Advanced Materials and Processing, Beijing, PEOPLES R CHINA, Web of Science.

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