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	Silicon vertical interconnect technology of low cost
	Feng Guo-qiang ; Cai Jian ; Wang Shui-di ; Jia Song-liang
	2010-05-07 ; 2010-05-07
关键词	Practical Experimental/ dielectric materials electroplating etching integrated circuit interconnections integrated circuit reliability nickel compounds potassium compounds silicon compounds/ silicon vertical interconnect technology etching process insulation layer adhesion layer barrier layer seed layer conductive layer photosensitive dry film thin film electroless plating capping layer high temperature anneal 10 micron SiO/sub 2/ NiMoP KOH/ B2550F Metallisation and interconnection technology B0170G General fabrication techniques B2550E Surface treatment (semiconductor technology) B2810 Dielectric materials and properties B0520J Deposition from liquid phases B0170N Reliability/ size 1.0E-05 m/ SiO2/int O2/int Si/int O/int SiO2/bin O2/bin Si/bin O/bin NiMoP/int Mo/int Ni/int P/int NiMoP/ss Mo/ss Ni/ss P/ss KOH/ss OH/ss H/ss K/ss O/ss
中文摘要	Vertical interconnect silicon via was made by KOH etching process. A SiO/sub 2/ layer was deposited as the insulation layer, sputtering Ti/Cu was applied for adhesion/barrier layer and seed layer. Electroplating Cu, 10 mu m, was used as conductive layer for the silicon vertical interconnects. In order to reroute the metal layer, photosensitive dry film was carried out on the ready vertical interconnect silicon wafer. Thin NiMoP film, 150~200 nm, was deposited on Cu traces by electroless plating as capping layer to prevent Cu from corrosion and diffusion into above dielectric. The reliability of Ti and NiMoP was verified by high temperature anneal.
语种	中文 ; 中文
出版者	Editorial Board of Semicond. Technol ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/16497]
专题	清华大学
推荐引用方式 GB/T 7714	Feng Guo-qiang,Cai Jian,Wang Shui-di,et al. Silicon vertical interconnect technology of low cost[J],2010, 2010.
APA	Feng Guo-qiang,Cai Jian,Wang Shui-di,&Jia Song-liang.(2010).Silicon vertical interconnect technology of low cost..
MLA	Feng Guo-qiang,et al."Silicon vertical interconnect technology of low cost".(2010).

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