Finite element analysis of expansion-matched submounts for high-power laser diodes packaging

	Finite element analysis of expansion-matched submounts for high-power laser diodes packaging
	Ni Yuxi ; Ma Xiaoyu ; Jing Hongqi ; Liu Suping
刊名	journal of semiconductors
	2016
卷号	37 期号:6 页码:064005
学科主题	半导体器件
收录类别	SCI
公开日期	2017-03-02
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/27673]
专题	半导体研究所_光电子器件国家工程中心
推荐引用方式 GB/T 7714	Ni Yuxi,Ma Xiaoyu,Jing Hongqi,et al. Finite element analysis of expansion-matched submounts for high-power laser diodes packaging[J]. journal of semiconductors,2016,37(6):064005.
APA	Ni Yuxi,Ma Xiaoyu,Jing Hongqi,&Liu Suping.(2016).Finite element analysis of expansion-matched submounts for high-power laser diodes packaging.journal of semiconductors,37(6),064005.
MLA	Ni Yuxi,et al."Finite element analysis of expansion-matched submounts for high-power laser diodes packaging".journal of semiconductors 37.6(2016):064005.