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	Multi-physics analysis of heat-structure on surface resistance
	Jianxu Hu; Maozhou Meng
	2011
会议名称	2011 International Conference on Information and Automation, ICIA 2011
会议地点	Shenzhen, China
英文摘要	The failure of electronic systems and equipment mostly happens in the welding parts between components and circuit board while the cycles of thermal expansion achieve a certain number, because the solder comes to fatigue cracking. In this paper, a sample about surface resistance was chosen to explain what relationship among the electric field, heat transfer, and structure expansion by using the multi-physics modeling and simulation software, COMSOL Multiphysics, to model these three physical fields in fully coupling. The components of the electric field, temperature field and stress field distribution were extracted to explain the interaction among these three physics fields. According to the results of numerical simulation, the engineer will be inspired to obtain an optimization structure and process.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/3592]
专题	深圳先进技术研究院_数字所
作者单位	2011
推荐引用方式 GB/T 7714	Jianxu Hu,Maozhou Meng. Multi-physics analysis of heat-structure on surface resistance[C]. 见:2011 International Conference on Information and Automation, ICIA 2011. Shenzhen, China.

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