| Influence of segregation and diffusion behavior on electrical properties | |
| Lifei Lai; Rong Sun; Xianzhu Fu; Ruxu Du | |
| 2012 | |
| 会议名称 | 2012 International Conference on Electronic Packaging Technology & High Density Packaging |
| 会议地点 | 中国 |
| 英文摘要 | The segregation and diffusion of Ni-Cr embedded thin film resistor (ETFR) materials under different annealing conditions were investigated. Strong segregation and diffusion were caused by annealing at high temperature. The electrical properties of Ni- Cr ETFR were affected by segregation and diffusion of metal, which led unstable TCR and large resistivity. |
| 收录类别 | EI |
| 语种 | 英语 |
| 内容类型 | 会议论文 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/3856]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2012 |
| 推荐引用方式 GB/T 7714 | Lifei Lai,Rong Sun,Xianzhu Fu,et al. Influence of segregation and diffusion behavior on electrical properties[C]. 见:2012 International Conference on Electronic Packaging Technology & High Density Packaging. 中国. |
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