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	Processing Technology of Embedded Thin-Film Resistor Materials
	Lifei Lai; Rong Sun; Tao Zhao; XiaoLiang Zeng; ShuHui YU
	2011
会议名称	2011 International Symposium on Advanced Packaging Materials
会议地点	Xiamen, China
英文摘要	It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/3369]
专题	深圳先进技术研究院_集成所
作者单位	2011
推荐引用方式 GB/T 7714	Lifei Lai,Rong Sun,Tao Zhao,et al. Processing Technology of Embedded Thin-Film Resistor Materials[C]. 见:2011 International Symposium on Advanced Packaging Materials. Xiamen, China.

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