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	Artificial Neural Network Application in Vertical Interconnection Modeling
	Yuanjun Liang; Lei Li
	2009
会议名称	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
英文摘要	This paper proposes a neural network-based method for modeling vertical interconnect balls. The π equivalent circuit with lumped element was used to characterize the electrical performance of balls. The values of lumped elements were extracted from the full-wave simulate result, and the extracted data was used to train back-propagation (BP) neural networks to obtain the relationship between the lumped element values and the physical size of the balls. Then this model was used to estimate the electrical character of ball with other layout parameters.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/2509]
专题	深圳先进技术研究院_集成所
作者单位	2009
推荐引用方式 GB/T 7714	Yuanjun Liang,Lei Li. Artificial Neural Network Application in Vertical Interconnection Modeling[C]. 见:2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009.

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