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	Modeling and Simulation of SSN on FPGA Products
	Lingzhi Ke; Peng Zhou; Lei Li
	2009
会议名称	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
英文摘要	Simultaneous switching noise (SSN) and its behavior have recently become more and more critical in IC and other high-speed system designs [1][2]. This is attributed to ever-increasing speed, frequency, density, and power, as well as decreasing circuit dimensions and logic levels. The difference in a few mill volts may cause the system to fail. Therefore, it is very important to understand the characteristics of the SSN glitch of an active device for correct system level performance. In this paper, some methods to provide a complete picture of limitation characteristic behavior and its relationship to cause scheme, due to SSN, is demonstrated with FPGA system. Furthermore, model simulation confirms our postulations made on examination of experimental data and validates the methodology practical to SSN assessment in FPGA applications.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/2508]
专题	深圳先进技术研究院_集成所
作者单位	2009
推荐引用方式 GB/T 7714	Lingzhi Ke,Peng Zhou,Lei Li. Modeling and Simulation of SSN on FPGA Products[C]. 见:2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009.

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