On Effective Through-Silicon Via Repair for 3-D-Stacked Ics

	On Effective Through-Silicon Via Repair for 3-D-Stacked Ics
	Jiang, Li; Xu, Qiang; Eklow, Bill
刊名	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
	2013
英文摘要	3-D-stacked integrated circuits (ICs) that employ through-silicon vias (TSVs) to connect multiple dies vertically have gained wide-spread interest in the semiconductor industry. In order to be commercially viable, the assembly yield for 3-D-stacked ICs must be as high as possible, requiring TSVs to be reparable. Existing techniques typically assume TSV faults to be uniformly distributed and use neighboring TSVs to repair faulty ones, if any. In practice, however, clustered TSV faults are quite common due to the fact that the TSV bonding quality depends on surface roughness and cleanness of silicon dies, rendering prior TSV redundancy solutions less effective. Furthermore, existing techniques consume a lot of redundant TSVs that are still costly in the current TSV process. This inefficient TSV redundancy can limit the amount of TSVs that is allowed to use and may even become the obstacle to commercial production. To resolve this problem, we present a novel TSV repair framework, including a hardware redundancy architecture that enables faulty TSVs to be repaired by redundant TSVs that are farther apart, the corresponding repair algorithm and the redundancy architecture construction. By doing so, the manufacturing yield for 3-D-stacked ICs can be dramatically improved, as demonstrated in our experimental results.
收录类别	SCI
原文出处	http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6480868
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/4469]
专题	深圳先进技术研究院_集成所
作者单位	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
推荐引用方式 GB/T 7714	Jiang, Li,Xu, Qiang,Eklow, Bill. On Effective Through-Silicon Via Repair for 3-D-Stacked Ics[J]. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2013.
APA	Jiang, Li,Xu, Qiang,&Eklow, Bill.(2013).On Effective Through-Silicon Via Repair for 3-D-Stacked Ics.IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
MLA	Jiang, Li,et al."On Effective Through-Silicon Via Repair for 3-D-Stacked Ics".IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2013).