Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates

	Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates
	Lai Lifei; Fu Xianzhu; Sun Rong; Du Ruxu
刊名	SURFACE & COATINGS TECHNOLOGY
	2013
英文摘要	NiCr (80/20 at.%) alloy thin film was deposited on the copper foil, glass and silicon substrates by DC magnetron sputtering method, respectively. The structure, stress and resistivity of NiCr thin films were affected by the different substrates. The preferred orientations of NiCr thin film were Ni (011) and Cr (011) on the copper foil substrate with rough surface, while only Ni (111) on the glass and silicon substrates. And the internal stress of NiCr thin film was tensile stress on the copper foil, while compressive stress on the glass and silicon substrates. These differences then resulted in larger resistivity of NiCr thin film deposited on copper foil than glass or silicon substrate. However, the temperature coefficient of resistance (TCR) of NiCr thin film was slightly influenced by the different substrates.
收录类别	SCI
原文出处	http://www.sciencedirect.com/science/article/pii/S0257897213007883
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/4456]
专题	深圳先进技术研究院_集成所
作者单位	SURFACE & COATINGS TECHNOLOGY
推荐引用方式 GB/T 7714	Lai Lifei,Fu Xianzhu,Sun Rong,et al. Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates[J]. SURFACE & COATINGS TECHNOLOGY,2013.
APA	Lai Lifei,Fu Xianzhu,Sun Rong,&Du Ruxu.(2013).Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates.SURFACE & COATINGS TECHNOLOGY.
MLA	Lai Lifei,et al."Comparison of microstructure and electrical properties of NiCr alloy thin film deposited on different substrates".SURFACE & COATINGS TECHNOLOGY (2013).