Microstructure and electrical properties of Ba0.7Sr0.3(Ti1-xZrx)O-3 thin films prepared oncopper foils with sol-gel method

	Microstructure and electrical properties of Ba0.7Sr0.3(Ti1-xZrx)O-3 thin films prepared oncopper foils with sol-gel method
	Yanhua Fan; Shuhui Yu; Rong Sun; Lei Li; Yansheng Yin; Ruxu Du
刊名	THIN SOLID FILMS
	2010
卷号	518 期号:14 页码:3610-3614
英文摘要	Ba0.7Sr0.3(Ti1-xZrx)O-3 (x=0, 0.1, 0.2) (BSZT) thin films have been prepared on copper foils using sol-gel method. The films were annealed in an atmosphere with low oxygen pressure so that the substrate oxidation was avoided and the formation of the perovskite phase was allowed. The X-ray diffraction results show a stable polycrystalline perovskite phase, with the diffraction peaks of the BSZT films shifting toward the smaller 20 with increasing Zr content. Scanning electron microscopy images show that the grain size of the BSZT thin films decreases with increasing Zr content. High resolution transmission electron microscopy shows the clear lattice and domain structure in the film. The dielectric peaks of the BSZT thin films broaden with increasing Zr content. Leakage current density of Ba0.7Sr0.3(Ti1-xZrx)O-3 (x = 0.1) thin film is the lowest over the whole applied voltage. (C) 2009 Elsevier B.V. All rights reserved.
收录类别	SCI
原文出处	http://www.sciencedirect.com/science/article/pii/S0040609009014989
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/2736]
专题	深圳先进技术研究院_集成所
作者单位	THIN SOLID FILMS
推荐引用方式 GB/T 7714	Yanhua Fan,Shuhui Yu,Rong Sun,et al. Microstructure and electrical properties of Ba0.7Sr0.3(Ti1-xZrx)O-3 thin films prepared oncopper foils with sol-gel method[J]. THIN SOLID FILMS,2010,518(14):3610-3614.
APA	Yanhua Fan,Shuhui Yu,Rong Sun,Lei Li,Yansheng Yin,&Ruxu Du.(2010).Microstructure and electrical properties of Ba0.7Sr0.3(Ti1-xZrx)O-3 thin films prepared oncopper foils with sol-gel method.THIN SOLID FILMS,518(14),3610-3614.
MLA	Yanhua Fan,et al."Microstructure and electrical properties of Ba0.7Sr0.3(Ti1-xZrx)O-3 thin films prepared oncopper foils with sol-gel method".THIN SOLID FILMS 518.14(2010):3610-3614.