Development of defects detection in gluing glass | |
Zongming, Wu1,2; Wei, Yang1; Tianquan, Fan1 | |
2012 | |
会议名称 | Proceedings of SPIE: 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes |
会议日期 | 2012 |
卷号 | 8415 |
页码 | 84150J |
通讯作者 | Zongming, W. |
中文摘要 | The defects engendering in the process of glass gluing are mainly flaws and delaminations which will reduce the stability and processing availability of the optical component. How to detect these defects has become a technical problem for a long time. Several Non-Destructive Test (NDT) methods such as ultrasonic C-scan, bubble tester and infrared thermography are effective in inspection of it at present. In this paper, these three techniques' detection principle, advantages and disadvantages are introduced. On the basis of detection demands, photothermal radiometry that it has become a powerful tool to detect subsurface defects in composites because of its non-contact and highly sensitivity is used to detect defects in the gluing process of glass for the first time. The basic idea that glass-layer transmits the spectrum and the spectrum energy is absorbed by glue-layer is also put forward creatively. By monitoring the temperature variation of glue-layer in time domain using infrared thermal imager, the defects can be discovered. © 2012 SPIE. |
英文摘要 | The defects engendering in the process of glass gluing are mainly flaws and delaminations which will reduce the stability and processing availability of the optical component. How to detect these defects has become a technical problem for a long time. Several Non-Destructive Test (NDT) methods such as ultrasonic C-scan, bubble tester and infrared thermography are effective in inspection of it at present. In this paper, these three techniques' detection principle, advantages and disadvantages are introduced. On the basis of detection demands, photothermal radiometry that it has become a powerful tool to detect subsurface defects in composites because of its non-contact and highly sensitivity is used to detect defects in the gluing process of glass for the first time. The basic idea that glass-layer transmits the spectrum and the spectrum energy is absorbed by glue-layer is also put forward creatively. By monitoring the temperature variation of glue-layer in time domain using infrared thermal imager, the defects can be discovered. © 2012 SPIE. |
收录类别 | EI |
语种 | 英语 |
ISSN号 | 0277786X |
内容类型 | 会议论文 |
源URL | [http://ir.ioe.ac.cn/handle/181551/7914] |
专题 | 光电技术研究所_质量处(质检中心) |
作者单位 | 1.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China 2.Graduate University, Chinese Academy of Sciences, Beijing 10049, China |
推荐引用方式 GB/T 7714 | Zongming, Wu,Wei, Yang,Tianquan, Fan. Development of defects detection in gluing glass[C]. 见:Proceedings of SPIE: 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Large Mirrors and Telescopes. 2012. |
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