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	Nanofabrication with sub-50nm features by imprinting-induced cracks
	Xia, Liangping1; Zhang, Man2; Yang, Zheng1; Yin, Shaoyun1; Du, Chunlei1
	2014
会议名称	Proceedings of SPIE: Optical Design and Testing VI
会议日期	2014
卷号	9272
页码	92720K
通讯作者	Xia, Liangping
中文摘要	Nanofabrication is the foundation of nanophotonics and has become a research hotspot in the last decades. The method annealing crack is proposed to transfer the nanocracks from ultraviolet (UV) resist to other photonic materials. The method is demonstrated by simulating the inner stress distribution with the thermal-structure analysis. In addition, the parameter influence to the maximum stress is discussed and the results indicate that the annealing temperature has a large effect. The method is simple, low cost, high efficiency and is a good candidate to fabricate nanophotonic structures with critical size less than 50nm. © 2014 SPIE.
英文摘要	Nanofabrication is the foundation of nanophotonics and has become a research hotspot in the last decades. The method annealing crack is proposed to transfer the nanocracks from ultraviolet (UV) resist to other photonic materials. The method is demonstrated by simulating the inner stress distribution with the thermal-structure analysis. In addition, the parameter influence to the maximum stress is discussed and the results indicate that the annealing temperature has a large effect. The method is simple, low cost, high efficiency and is a good candidate to fabricate nanophotonic structures with critical size less than 50nm. © 2014 SPIE.
收录类别	EI
学科主题	Cracks - Nanophotonics - Optical design
语种	英语
ISSN号	0277786X
内容类型	会议论文
源URL	[http://ir.ioe.ac.cn/handle/181551/7669]
专题	光电技术研究所_微电子装备总体研究室（四室）
作者单位	1.Key Laboratory of Multi-scale Manufacturing Technology, Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing, China 2.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu, China
推荐引用方式 GB/T 7714	Xia, Liangping,Zhang, Man,Yang, Zheng,et al. Nanofabrication with sub-50nm features by imprinting-induced cracks[C]. 见:Proceedings of SPIE: Optical Design and Testing VI. 2014.

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