Optical and photo-carrier characterization of ultra-shallow junctions in silicon
Huang, Qiuping1,2; Li, Bincheng1; Ren, Shengdong1,2
刊名Science China: Physics, Mechanics and Astronomy
2013
卷号56期号:7页码:1294-1300
ISSN号16747348
通讯作者Li, B. (bcli@ioe.ac.cn)
中文摘要Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implantation at energies of 0.5-5 keV, at a dose of 1×1015 As+/cm2 and spike annealing. Experimentally the damaged layer of the as-implanted wafer and the recrystallization and activation of the post-annealed wafer were evaluated by SE in the spectral range from 0.27 to 20 μm. The PCR amplitude decreased monotonically with the increasing implantation energy. The experimental results also showed that the PCR amplitudes of post-annealed USJ wafers were greatly enhanced, compared to the non-implanted and non-annealed substrate wafer. The PL measurements showed the enhanced PCR signals were attributed to the band-edge emissions of silicon. For explaining the PL enhancement, the electronic transport properties of USJ wafers were extracted via multi-wavelength PCR experiment and fitting. The fitted results showed the decreasing surface recombination velocity and the decreasing diffusion coefficient of the implanted layer contributed to the PCR signal enhancement with the decreasing implantation energy. SE, PCR and PL were proven to be non-destructive metrology tools for characterizing ultra-shallow junctions. © 2013 Science China Press and Springer-Verlag Berlin Heidelberg.
英文摘要Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implantation at energies of 0.5-5 keV, at a dose of 1×1015 As+/cm2 and spike annealing. Experimentally the damaged layer of the as-implanted wafer and the recrystallization and activation of the post-annealed wafer were evaluated by SE in the spectral range from 0.27 to 20 μm. The PCR amplitude decreased monotonically with the increasing implantation energy. The experimental results also showed that the PCR amplitudes of post-annealed USJ wafers were greatly enhanced, compared to the non-implanted and non-annealed substrate wafer. The PL measurements showed the enhanced PCR signals were attributed to the band-edge emissions of silicon. For explaining the PL enhancement, the electronic transport properties of USJ wafers were extracted via multi-wavelength PCR experiment and fitting. The fitted results showed the decreasing surface recombination velocity and the decreasing diffusion coefficient of the implanted layer contributed to the PCR signal enhancement with the decreasing implantation energy. SE, PCR and PL were proven to be non-destructive metrology tools for characterizing ultra-shallow junctions. © 2013 Science China Press and Springer-Verlag Berlin Heidelberg.
学科主题Annealing - Diffusion - Ion implantation - Photoelectricity - Photoluminescence - Radiometers - Radiometry - Silicon - Spectroscopic ellipsometry - Transport properties
收录类别SCI ; EI
语种英语
WOS记录号WOS:000320502800009
内容类型期刊论文
源URL[http://ir.ioe.ac.cn/handle/181551/6620]  
专题光电技术研究所_薄膜光学技术研究室(十一室)
作者单位1.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 610209, China
2.University of Chinese Academy of Sciences, Beijing 100039, China
推荐引用方式
GB/T 7714
Huang, Qiuping,Li, Bincheng,Ren, Shengdong. Optical and photo-carrier characterization of ultra-shallow junctions in silicon[J]. Science China: Physics, Mechanics and Astronomy,2013,56(7):1294-1300.
APA Huang, Qiuping,Li, Bincheng,&Ren, Shengdong.(2013).Optical and photo-carrier characterization of ultra-shallow junctions in silicon.Science China: Physics, Mechanics and Astronomy,56(7),1294-1300.
MLA Huang, Qiuping,et al."Optical and photo-carrier characterization of ultra-shallow junctions in silicon".Science China: Physics, Mechanics and Astronomy 56.7(2013):1294-1300.
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