Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling

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	Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
	Ma, Huicai ; Guo, Jingdong ; Chen, Jianqiang ; Wu, Di ; Liu, Zhiquan ; Zhu, Qingsheng ; Shang, Jianku ; Zhang, Li ; Guo, Hongyan
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2016
卷号	27 期号:2 页码:1184-1190
ISSN号	0957-4522
通讯作者	jdguo@imr.ac.cn ; jkshang@imr.ac.cn
收录类别	SCI
资助信息	Natural Science Foundation of China [51171191, 51471180]; Major National Science and Technology Program of China [2011ZX02602]; Natural Science Foundation of Liaoning Province [2013020015]
语种	英语
公开日期	2016-04-21
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/75066]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Ma, Huicai,Guo, Jingdong,Chen, Jianqiang,et al. Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27(2):1184-1190.
APA	Ma, Huicai.,Guo, Jingdong.,Chen, Jianqiang.,Wu, Di.,Liu, Zhiquan.,...&Guo, Hongyan.(2016).Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27(2),1184-1190.
MLA	Ma, Huicai,et al."Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.2(2016):1184-1190.