Enhancing buckypaper conductivity through co-deposition with copper nanowires

CORC > 苏州纳米技术与纳米仿生研究所 > 中国科学院苏州纳米技术与纳米仿生研究所 > 先进材料研究部 > 李清文团队

	Enhancing buckypaper conductivity through co-deposition with copper nanowires
	Li, QW(李清文); Zhang, XH(张骁骅); Chen, HY(陈宏源)
刊名	CARBON
	2013-09
卷号	61 期号:0 页码:501-506
通讯作者	Li, QW(李清文)
英文摘要	Buckypapers, the thin sheets made from an aggregate of carbon nanotubes (CNTs), have demonstrated promising electrical and thermal conductivities. However, the high in-plane to perpendicular anisotropy makes its application as thermal interface materials difficult. In order to increase the perpendicular electrical and thermal conductivities, copper nanowires (Cu NWs) were introduced into buckypapers. The Cu NWs stuck into the empty spaces between CNTs, connected them perpendicularly, and even induced a certain perpendicular CNT alignment. The electrical conductivity increased continuously with increasing the Cu content, while the smallest anisotropy was observed at the 50 wt.% Cu filling because an in-plane Cu network formed and improved much more the in-plane conductivity above this filling. On the contrary, as CNTs are more thermally conducting than Cu, the loading of Cu NWs over 50 wt.% decreased the thermal conductivity. Our measurement showed a high perpendicular conductivity of 10.1 W/m K at the 50 wt.% loading, more than quadruple and double as compared with the ones for a pure buckypaper and the one filled with 67-75 wt.% Cu NWs. (C) 2013 Elsevier Ltd. All rights reserved.
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000322208700057
公开日期	2014-01-13
内容类型	期刊论文
源URL	[http://ir.sinano.ac.cn/handle/332007/1306]
专题	苏州纳米技术与纳米仿生研究所_先进材料研究部_李清文团队
通讯作者	Li, QW(李清文)
推荐引用方式 GB/T 7714	Li, QW,Zhang, XH,Chen, HY. Enhancing buckypaper conductivity through co-deposition with copper nanowires[J]. CARBON,2013,61(0):501-506.
APA	Li, QW,Zhang, XH,&Chen, HY.(2013).Enhancing buckypaper conductivity through co-deposition with copper nanowires.CARBON,61(0),501-506.
MLA	Li, QW,et al."Enhancing buckypaper conductivity through co-deposition with copper nanowires".CARBON 61.0(2013):501-506.