Low Leakage Current and High-Cutoff Frequency AlGaN/GaN MOSHEMT Using Submicrometer-Footprint Thermal Oxidized TiO2/NiO as Gate Dielectric
Zhang, YH(张耀辉)
刊名IEEE ELECTRON DEVICE LETTERS
2013-06
卷号34期号:6页码:738-740
关键词AlGaN/GaN cutoff frequency metal oxide semiconductor high electron mobility transistor (MOSHEMT) thermal oxidized TiO2
通讯作者Meng, D
英文摘要AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOSHEMTs) with thick (>35 nm), high-kappa (TiO2/NiO), submicrometer-footprint (0.4 mu m) gate dielectric are found to exhibit two orders of magnitude in lower gate leakage current (similar to 1 nA/mm up to +3-V applied gate bias), higher I-MAX (709 mA/mm), and higher drain breakdown voltage, compared to Schottky barrier (SB) HEMTs of the same geometry. The maximum extrinsic transconductance of both the MOSHEMTs and the SBHEMTs with 2 x 80-mu m gate fingers is measured to be 149 mS/mm. The addition of the submicrometer-footprint gate oxide layer only results in a small reduction of the current gain cutoff frequency (21 versus 25 GHz, derived from S-parameter test data) because of the high permittivity (kappa approximate to 100) of the gate dielectric. This high-performance submicrometer-footprint MOSHEMT is highly promising for microwave power amplifier applications in communication and radar systems.
收录类别SCI ; EI
语种英语
WOS记录号WOS:000319460800007
公开日期2014-01-15
内容类型期刊论文
源URL[http://ir.sinano.ac.cn/handle/332007/1365]  
专题苏州纳米技术与纳米仿生研究所_系统集成与IC设计部_张耀辉团队
推荐引用方式
GB/T 7714
Zhang, YH. Low Leakage Current and High-Cutoff Frequency AlGaN/GaN MOSHEMT Using Submicrometer-Footprint Thermal Oxidized TiO2/NiO as Gate Dielectric[J]. IEEE ELECTRON DEVICE LETTERS,2013,34(6):738-740.
APA Zhang, YH.(2013).Low Leakage Current and High-Cutoff Frequency AlGaN/GaN MOSHEMT Using Submicrometer-Footprint Thermal Oxidized TiO2/NiO as Gate Dielectric.IEEE ELECTRON DEVICE LETTERS,34(6),738-740.
MLA Zhang, YH."Low Leakage Current and High-Cutoff Frequency AlGaN/GaN MOSHEMT Using Submicrometer-Footprint Thermal Oxidized TiO2/NiO as Gate Dielectric".IEEE ELECTRON DEVICE LETTERS 34.6(2013):738-740.
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