Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment

CORC > 生态环境研究中心 > 中国科学院生态环境研究中心 > 固体废弃物处理与资源化实验室

	Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment
	Xiu, Fu-Rong; Qi, Yingying; Zhang, Fu-Shen
刊名	WASTE MANAGEMENT
	2015-07
卷号	41 页码:134-141
关键词	Waste printed circuit board Gold Leaching Iodide Supercritical water
英文摘要	Precious metals are the most attractive resources in waste printed circuit boards (PCBs) of mobile phones. In this work, an alternative process for recovering Au, Ag, and Pd from waste PCBs of mobile phones by supercritical water oxidation (SCWO) pre-treatment combined with iodine-iodide leaching process was developed. In the process, the waste PCBs of mobile phones were pre-treated in supercritical water, then a diluted hydrochloric acid leaching (HL) process was used to recovery the Cu, whose leaching efficiency was approximately 100%, finally the resulting residue was subjected to the iodine-iodide leaching process for recovering the Au, Ag, and Pd. Experimental results indicated that SCWO pre-treatment temperature, time, and pressure had significant influence on the Au, Ag, and Pd leaching from (SCWO + HL)-treated waste PCBs. The optimal SCWO pre-treatment conditions were 420 degrees C and 60 min for Au and Pd, and 410 degrees C and 30 min for Ag. The optimum dissolution parameters for Au, Pd, and Ag in (SCWO + HL)-treated PCBs with iodine-iodide system were leaching time of 120 min (90 min for Ag), iodine/iodide mole ratio of 1:5 (1:6 for Ag), solid-to-liquid ratio (S/L) of 1:10 g/mL (1:8 g/mL for Ag), and pH of 9, respectively. It is believed that the process developed in this study is environment friendly for the recovery of Au, Ag, and Pd from waste PCBs of mobile phones by SCWO pre-treatment combined with iodine-iodide leaching process. (C) 2015 Elsevier Ltd. All rights reserved.
研究领域[WOS]	Engineering, Environmental ; Environmental Sciences
WOS记录号	WOS:000356643300016
公开日期	2016-03-15
内容类型	期刊论文
源URL	[http://ir.rcees.ac.cn/handle/311016/32495]
专题	生态环境研究中心_固体废弃物处理与资源化实验室
推荐引用方式 GB/T 7714	Xiu, Fu-Rong,Qi, Yingying,Zhang, Fu-Shen. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment[J]. WASTE MANAGEMENT,2015,41:134-141.
APA	Xiu, Fu-Rong,Qi, Yingying,&Zhang, Fu-Shen.(2015).Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment.WASTE MANAGEMENT,41,134-141.
MLA	Xiu, Fu-Rong,et al."Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment".WASTE MANAGEMENT 41(2015):134-141.