Effect of Stress-Induced Grain Growth During Room Temperature Tensile Deformation on Ductility in Nanocrystalline Metals

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	Effect of Stress-Induced Grain Growth During Room Temperature Tensile Deformation on Ductility in Nanocrystalline Metals
	Xu WC; Dai PQ; Wu XL(武晓雷)
刊名	BULLETIN OF MATERIALS SCIENCE
	2010
通讯作者邮箱	pqdai@l26.com
卷号	33 期号:5 页码:561-568
关键词	Nanocrystalline Ni-Co mechanical property ductility grain growth
ISSN号	0250-4707
通讯作者	Dai, PQ (reprint author), Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Peoples R China.
产权排序	[Xu, Weichang; Dai, Pinqiang] Fuzhou Univ, Coll Mat Sci & Engn, Fuzhou 350108, Peoples R China; [Wu, Xiaolei] Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China
中文摘要	In the present study defect-free nanocrystalline (nc) Ni-Co alloys with the Co content ranging from 2.4-59.3% (wt.%) were prepared by pulse electrodeposition. X-ray diffraction analysis shows that only a single face-centred cubic solid solution is formed for each alloy and that the grain size reduces monotonically with increasing Co content, which is consistent with transmission electron microscopy (TEM) observations. In the nc Ni-Co alloys, both the ultimate tensile strength and the elongation to failure increase as the Co content increases. The TEM observations reveal that stress-induced grain growth during tensile deformation is significantly suppressed for the nc Ni-Co alloys rich in Co in sharp contrast to those poor in Co. We believe that sufficient solutes could effectively pin grain boundaries making grain boundary motions (e.g. grain boundary migration and/or grain rotation) during deformation more difficult. Thus, stress-induced grain growth is greatly suppressed. At the same time, shear banding plasticity instability is correspondingly delayed leading to the enhanced ductility.
类目[WOS]	Materials Science, Multidisciplinary
研究领域[WOS]	Materials Science
关键词[WOS]	CENTERED-CUBIC METALS ; STACKING-FAULT ENERGY ; PLASTIC-DEFORMATION ; BOUNDARY ; ALLOYS ; COPPER ; NI ; DYNAMICS ; NICKEL ; MICROSTRUCTURE
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000286346700008
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/58601]
专题	力学研究所_非线性力学国家重点实验室
推荐引用方式 GB/T 7714	Xu WC,Dai PQ,Wu XL. Effect of Stress-Induced Grain Growth During Room Temperature Tensile Deformation on Ductility in Nanocrystalline Metals[J]. BULLETIN OF MATERIALS SCIENCE,2010,33(5):561-568.
APA	Xu WC,Dai PQ,&武晓雷.(2010).Effect of Stress-Induced Grain Growth During Room Temperature Tensile Deformation on Ductility in Nanocrystalline Metals.BULLETIN OF MATERIALS SCIENCE,33(5),561-568.
MLA	Xu WC,et al."Effect of Stress-Induced Grain Growth During Room Temperature Tensile Deformation on Ductility in Nanocrystalline Metals".BULLETIN OF MATERIALS SCIENCE 33.5(2010):561-568.